Can be used in Low-profile Cases. Recommend CPU: i3 9100 / F, G4560,G4600, or any TDP lower than 65W.
The heat dissipation effect of the integrated forming process is better.
It conforms to the rules of increasing heat distribution and gives full play to the heat dissipation performance.
PC raw material fan blade, not easy to break.
Metal scales are conducive to the rapid dispersion of heat.
Applicable to most CPU platforms on the market, INTEL 775, 1150, 1155, 1156, AM2, AM2+, AM3, FM1.
FIN heat pipe penetration technology: heat pipe penetration technology is conducive to the rapid transfer of heat to the radiator.
Adopts the HDT process.
Brand New CPU Cooler for Low-Profile PC Cases
Speed: 2000 RPM + 10%
Product only: 123*123*70MM
Noise: 20DBA + 10%
Bearing type: HDB
Service life: 50000 + hours
Air volume: 48CFM